Ansiki Pochoir de reballage universel BGA 0,3-0,5 mm, modèle de soudure CPU à trou 45 °

Caractéristiques et spécifications du pochoir de reballage Ansiki Universal BGA

The stainless steel solder stencil is laser-cut to hold five pitch increments — 0.3, 0.35, 0.375, 0.4, and 0.5 mm — so you handle the full range of modern mobile phone CPU packages with a single universal multi-purpose tool. Each aperture uses a 45° angled hole geometry that channels solder paste downward into the pad, reducing voids and cold joints that plague flat-cut stencils. The material resists flux corrosion and thermal distortion, meaning the stencil stays flat and dimensionally accurate after hundreds of reballing sessions. Precision PCB repair technicians will appreciate the tight aperture tolerances, which keep ball diameter variation under 0.02 mm for consistent, reliable joints every time. Vous obtenez un résultat de qualité professionnelle sur le reballage du CPU, du GPU et des puces BGA sans investir dans des jeux de pochoirs séparés spécifiques au pitch.