Ansiki Universal BGA Reballing Stencil 0.3-0.5mm 45° Hole CPU Solder Template

Ansiki Universal BGA Reballing Stencil Features and Specifications

The stainless steel solder stencil is laser-cut to hold five pitch increments — 0.3, 0.35, 0.375, 0.4, and 0.5 mm — so you handle the full range of modern mobile phone CPU packages with a single universal multi-purpose tool. Each aperture uses a 45° angled hole geometry that channels solder paste downward into the pad, reducing voids and cold joints that plague flat-cut stencils. The material resists flux corrosion and thermal distortion, meaning the stencil stays flat and dimensionally accurate after hundreds of reballing sessions. Precision PCB repair technicians will appreciate the tight aperture tolerances, which keep ball diameter variation under 0.02 mm for consistent, reliable joints every time. You get a professional-grade result on CPU, GPU, and BGA chip reballing without investing in separate pitch-specific stencil sets.